A research team led by Dr. Hyun-Ae Cha from the Korea Institute of Materials Science (KIMS) has developed a groundbreaking heat-dissipating composite material that combines eco-friendliness with low-cost processing. Utilizing a protein foaming method inspired by egg whites, the team created a three-dimensional magnesium oxide (MgO) structure that enhances thermal conductivity, achieving levels up to 2.6 times higher than traditional heat-dissipating composites.
As electronic devices become increasingly powerful and compact, they generate greater amounts of heat, necessitating advanced thermal management solutions. In electric vehicles (EVs), inadequate battery cooling can lead to performance issues, fires, or explosions, underscoring the critical need for effective thermal management systems. Central to these systems is the Thermal Interface Material (TIM), which is essential for efficient heat dissipation.
Traditional TIMs are often produced by mixing thermally conductive fillers into a polymer matrix, leading to random dispersion of the fillers. This method can disrupt thermal pathways and compromise overall performance. Increasing the filler content might enhance conductivity, but it also raises processing challenges and costs, limiting scalability.
To tackle these issues, the research team employed a novel approach using protein foaming to create a dense and uniformly interconnected particle structure. By leveraging the property of egg-white proteins that expand at high temperatures, the team successfully established a three-dimensional network of particles. This innovation resulted in a composite material with continuous thermal pathways that facilitate uninterrupted heat transfer. The newly developed TIM demonstrated a thermal conductivity of 17.19 W/m·K, showcasing exceptional heat dissipation capabilities.
One of the notable advantages of this new material is its use of magnesium oxide, a lightweight and cost-effective option. The composite’s thermal conductivity surpasses that of commonly used aluminum oxide (Al2O3) and nitride-based materials. Furthermore, by integrating the composite with epoxy resin—a polymer typically used to enhance adhesion with thermal fillers—the team created a practically applicable material suitable for various real-world applications.
This technology is poised to significantly improve the performance and stability of high-heat-generating devices, including electronic equipment, semiconductor packages, EV batteries, 5G communication devices, and high-performance servers. Notably, the domestic market for thermal interface materials in South Korea is projected to exceed KRW 200 billion annually, with a heavy reliance on imports. The commercialization of this innovative material is expected to bolster Korea’s technological self-reliance in thermal management.
Dr. Cha emphasized the potential of this method, stating, “Through the protein foaming–based process, we can produce high–thermal–conductivity materials in an eco-friendly and cost-effective way.” She added, “This study serves as a strong example demonstrating the feasibility of developing lightweight, high-performance heat-dissipating materials.”
The findings of this research were published on May 28, 2023, in the prestigious journal Advanced Science (Impact Factor: 15.1), where it was selected as the cover article for Volume 12, Issue 33. This research was funded by the National Research Foundation of Korea (NRF) as part of the Nano Materials Technology Development Program.
The work of KIMS, a non-profit government-funded institute under the Ministry of Science and ICT of the Republic of Korea, plays a vital role in advancing materials science and technology. As the only institute specializing in comprehensive materials technologies in Korea, KIMS has contributed significantly to the nation’s industrial capabilities through research, development, and technological support.
